JPH03104737U - - Google Patents
Info
- Publication number
- JPH03104737U JPH03104737U JP1275190U JP1275190U JPH03104737U JP H03104737 U JPH03104737 U JP H03104737U JP 1275190 U JP1275190 U JP 1275190U JP 1275190 U JP1275190 U JP 1275190U JP H03104737 U JPH03104737 U JP H03104737U
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- substrate
- semiconductor chip
- sealing resin
- supplying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1275190U JPH03104737U (en]) | 1990-02-14 | 1990-02-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1275190U JPH03104737U (en]) | 1990-02-14 | 1990-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03104737U true JPH03104737U (en]) | 1991-10-30 |
Family
ID=31516208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1275190U Pending JPH03104737U (en]) | 1990-02-14 | 1990-02-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03104737U (en]) |
-
1990
- 1990-02-14 JP JP1275190U patent/JPH03104737U/ja active Pending
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